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                  0574-58121888

                  PRODUCTS

                  Products

                  Bumping & WLP

                  Through the Bumping and RDL technology of Wafer Level Packaging, the I/O re-layout and solder / copper pillar bumps on the surface of the wafer are used to realize the bump processing of Flip-Chip

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                  Bumping & WLP

                  BGA Package

                  BGA(Ball Grid Array): Interconnection of chip and substrate is realized by using Die bond/Wire bond or advanced normal chip combine with Flip chip named Hybrid BGA technology

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                  BGA Package

                  QFN/QFP Lead Frame Package

                  QFN (Quad Flat No-Lead Package) and QFP (Quad Flat Package): Base on copper Lead Frame QFN and QFP packages with large exposed pads in the center of the package for thermal conduction

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                  QFN/QFP Lead Frame Package

                  MEMS/Optical Sensor Package

                  MEMS (Micro Electro Mechanical Systems) Microphones: Microphones based on MEMS technology are capacitors integrated on micro-silicon wafers and manufactured using a surface-mount process that can withstand high reflow temperatures

                  Learn more
                  MEMS/Optical Sensor Package

                  Flip-Chip

                  FCCSP/FCBGA (Flip-chip CSP/BGA): Advanced high-precision Flip chip level packages with Cu pillar or Solder bump by flipping the chip over and attaching it to the substrate

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                  Flip-Chip

                  SiP(System in Package)

                  SiP(System in Package): From the traditional Single chip with passive components, developing to Multi chip multifunctional chip with passive components, including normal chip (Die bond/Wire bond) and Flip chip hybrid packaging technology

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                  SiP(System in  Package)

                  News

                  About Forehope Electronics
                  Forehope Electronic (Ningbo) Co., Ltd. was listed in November 2022 on the Science and Technology Board of the Stock Exchange, Stock Name: Forehope Electronics, Stock Code: 688362. The company was founded in November 2017, mainly engaged in the development of integrated circuit packaging and testing solutions, assembly and test of different types of integrated circuit chips.
                  Learn more
                  • Commitment

                    Commitment

                    We stick to our commitments to customers, suppliers, employees, shareholders, and once we make a commitment, we will do our best to support.
                  • Fairness

                    Fairness

                    Establishing a fair and open management model, creating a serious and lively working environment.
                  • Cooperation

                    Cooperation

                    Focus on assembly and testing. Emphasis on long-term strategy and teamwork, and pursuit of sustainable management.

                  News

                  News More News

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